Due to shorter processing times and smaller component sizes, DEK has recently developed a new generation of devices and tool sets to achieve ultra-thin coatings of chip-fitting materials down to 25 μm on the backside of wafers. Addressing many of the manufacturing challenges faced by traditional dispensing methods and die attach processes, such as the inability to achieve new UPH speed requirements, die attach fillet formation, chip size limitations due to resin seepage, and adhesive layer coverage Insufficient or inconsistent quality and reliability issues arise, and DEK's new printing system can effectively solve these problems, allowing manufacturers to apply high-speed and high-precision printing processes to apply die-bonding materials. 25μm (±7μm) uniform ultra-thin coating. DEK wafer backside coating process utilizes micro-scale Galaxy mass extrusion printing system, DEK engineering ultra-flat carrier, die-attach adhesive printing plate or mesh plate and special design scraper, adjustable in high precision and elasticity The stencil printing platform realizes ultra-thin and accurate printing of the die-bonding glue at a high speed. The process method can also control the thickness of the adhesive layer according to the specification requirements proposed by the user. The new process adopts the same control of the chip-shaped peripheral tape-shaped forming as the traditional film-formed products, but it can save 20-30% of the cost. Compared with the dispensing method, the UPH shows an exponential improvement. The coated wafer can be pre-manufactured and stored for future use. In addition, ultra-thin coatings of 25 μm have been realized through ultra-flat carriers and specially-designed blades. The ultra-flat carrier provides stability and uniformity for wafers with a minimum thickness of 100 μm and a maximum diameter of 300 mm, while a special blade can apply glue very delicately on the back of the wafer. In addition, the DEK process also eliminates the subsequent reduction in peripheral tape formation and dispense volume, centralizing wet adhesive applications in the factory's dedicated print area to improve inventory management and simplify the supply chain. The DEK process not only promotes the development of die attach materials, but also can be applied to all wafer level coating processes, including epoxy adhesive layers and wafer level backside protective coatings. Because the process is performed on a large number of elastically-adjustable extrusion printing platforms, the system can easily be processed and filled for other packaging applications such as wafer bumps, DirEKt Ball Placement, and thermal interface materials (TIM). Plastic molds and other redeployment. Source: Surface Treatment Frequency