I. Introduction: As a special interconnection technology, a flex-rigid multilayer printed board can reduce the assembly size and weight of electronic products, avoid connection errors, realize three-dimensional assembly under different assembly conditions, and have The characteristics of lightness, thinness, shortness, and smallness have been widely used in computers, avionics, and military electronic equipment. However, rigid-flexible printed boards also have disadvantages such as complicated processes, high production costs, and difficulty in change and repair. This paper mainly discusses the improvement of rigid-flexible multi-layer printed board lamination and outer layer imaging, and discusses the production of rigid-flexible printed boards. Second, rigid flexible printed board structure: Rigid-flex PCBs are bonded to two (or more than two) rigid outer layers on a flexible printed board. The circuit on the rigid layer and the circuitry on the flexible layer communicate with each other through metalized holes. Each rigid flexible printed board has one or more rigid areas and one or more flexible areas. Figure 1 shows the structure of a typical eight-layer rigid-flex printed board. Third, rigid flexible printed board production process: 