DEK Corporation once again successfully developed a bulk extrusion printing solution that can provide higher production capacity, high level of accuracy, and high efficiency and flexible processing capabilities. According to reports, DEK's SinguLign enables a single substrate or component to directly use a carrier to perform high-precision mass extrusion printing of solder paste, solder balls, flux, and glue, and other materials, allowing known-good component sizes that can be accurately processed. To the minimum 20mm. Through the use of high-precision printing platforms, special tools, carriers, and miniaturized print or ball heads, individual parts can be repeatedly and accurately coated. A carrier equipped with multiple substrates will enter the press, and the vacuum tower will suck the first substrate or assembly to the print height, hold it in place and align with the screen. After the substrate has been printed with suitable materials for a specific application, it will be gently dropped back into the vehicle. All parts in the vehicle will repeat this operation and the carrier will be transported to the next process. Steve Watkin, DEK Semiconductor and Alternative Applications Manager, said: “This is a true breakthrough in the handling of individual parts; the ability to individually align and mass-press print known-good parts on recognized high-speed platforms is a significant yield improvement and Strengthen the assurance of process control." This unique tool and part handling mechanism provides maximum print support and enables very high processing time for individual parts: as little as 20 seconds for ball placement, and shorter time for other printing processes. Other advantages of DEK SinguLign include: the ability to align by substrate characteristics (rather than the edge of the package) to achieve ultra-compact printing, thereby improving accuracy; having only known qualified parts and supporting composite processes such as printing solder paste, assist The ability of fluxes, solder balls, or glues greatly increases the yield. The flexibility of the technology helps to print substrates or pre-packaged 3D components, while the versatility of the bulk extrusion printing platform can easily be changed to accommodate other packaging processes, which can significantly reduce the cost of ownership for users. DEK's SinguLign now provides packaging experts with the ability to align and print multiple substrates and components for ultra-compact printing, enabling a significant increase in productivity and end-of-line yields. Source: International Electronics Business